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Device Modelling (Technology) Senior/Staff/Principal Engineer in Multinational microelectronic industry Co
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[Company Status]
ȸ»ç´Â µ¶ÀÏ¿¡ º»»ç°¡ ÀÖ°í AP´Â ¸»·¹ÀÌÁö¾Æ ÀÖ´Â ÀüÀÚ ¹× ¹ÝµµÃ¼ ºÐ¾ß ´Ù±¹Àû ±â¾÷À¸·Î Device Modelling (Technology) Àü¹®°¡ Senior/Staff/Principal Engineer¸¦ ¸ð½Ê´Ï´Ù.
[Job Title]
Senior/Staff/Principal Engineer – Device Modelling (Technology)
a. Position can be based in Kuching, Malaysia/Germany
b. Reports to Global Device Modelling Manager.
c. Minimum 5-15 years working experience with hands-on experience in key device modelling tools (ICCAP, Accelicon, BsimPro+, SPICE, Cadence).
d. Pre-requisite/compulsory experience: Knowledge of the following:
i. semiconductor device physics and device characterization.
ii. parasitic extraction and design verification.
iii. understanding of silicon processing, process integration work and process flow.
iv. exposure in device/circuit simulation and layout editing tool.
e. Budget: RM6,000-RM20,000/month depending on experience & level of position
[JOB SUMMARY]
• To characterize and analyze micro-electronic devices.
• To perform device model extraction from measurement data.
• To ensure accurate device model and addressing model issues.
• To implement technical documentation for new device development.
• To develop and implement test structures, test chip layout construction and design rule validation.
[MAJOR RESPONSIBILITIES]
• Characterize MOS and BJT devices, and other passive primitive devices. Experience with RF /HV /Opto characterization, noise characterization is an added advantage.
• To generate, calibrate and verify spice model parameters and ensure quality spice files.
• Support model and methodology development to address accuracy of models, modeling issues of statistical variation and reliability concern.
• To support interconnect model verification and layout parasitic extraction.
• To help strategize, propose and develop required infrastructure to support leading edge characterization capability within MNC group.
• Design test structure layout to verify process capability and model accuracy, and test pattern improvement.
[Requirements]
[Qualification]
PHd/Master/Bachelor degree in Electronic Engineering (Material, Semiconductor Physics, Microelectronic).
[Experience]
Minimum 5-10 years working experience with hands-on experience in key modelling tools (ICCAP, Accelicon, BsimPro+, SPICE, Cadence). Understanding the requirements of analog design is added advantage.
[Skills/Competencies]
Technical/ Functional Competencies
a. In depth knowledge and exposure to the basic semiconductor measurement equipment, such as semiconductor analyzer.
b. Knowledge and understanding of semiconductor device physics and device characterization.
c. Knowledge and understanding of parasitic extraction and design verification.
d. Knowledge and understanding of silicon processing, process integration work and process flow.
e. Knowledge and exposure in device/circuit simulation and layout editing tool.
f. Strong interest in state of the art semiconductor devices development.
g. Knowledge and understanding of data analysis and statistical methods.
• Self-motivated with good interpersonal and communication skills in English
[Location]
Based in Kuching, Malaysia.
[Number of Persons] 1
[Salary Expectation]
Negotiable
[Foreign Languages] English
[Apply a Position]
Please send your English resume(Documents/ CVs must be written in English)A.S.A.P (MS word only)by E-mail top@topheadhunter.co.kr
* The title of E-mail should be Device Modelling (Technology) Principal Engineer in Multinational microelectronic industry Company.
* All submitted documents will be treated with highly confidential manner.
Thank you for your interest.
[Contact]
Tel No 82-2-555-7234
E-mail top@topheadhunter.co.kr
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