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BEOL Interconnect Reliability Engineer in Multinational microelectronic industry Co
[Company Status]
ȸ»ç´Â µ¶ÀÏ¿¡ º»»ç°¡ ÀÖ°í AP´Â ¸»·¹ÀÌÁö¾Æ ÀÖ´Â ÀüÀÚ ¹× ¹ÝµµÃ¼ ºÐ¾ß ´Ù±¹Àû ±â¾÷À¸·Î BEOL Interconnect Reliability Engineer¸¦ ¸ð½Ê´Ï´Ù.

[Title]
BEOL Interconnect Reliability Staff / Principal ENGINEER

[DEPT]
Process Characterization

[REPORTING TO]
Process Characterization Senior Section Manager

[Job Summary]
To optimize BEOL Interconnect reliability in the development of mixed signal semiconductor processes, achieving robust automotive standards. 
To plan, coordinate and execute of all necessary Wafer Level Reliability (WLR) design, development and debugging activities. 
To develop methodology for WLR testing and assessment.

[Major Responsibilities]
Define and develop interconnect reliability characterization strategy in mixed signal semiconductor processes. 
Define, develop and evaluate reliability procedures and methodology. 
Involve in characterization and analysis for the reliability of mixed signal semiconductor devices. 
New and existing technologies reliability test structure and test algorithms development and enhancement, also include modification and maintenance. 
Make and present reliability result in appropriate documentation and also to customers. 
Make assessment of new WLR reliability testing. 
To plan, manage and technically supervise reliability for new technology development projects. 
Align project objective with company overall business goals

[Responsibilities]
Project partner of new technology Interconnect reliability development and qualification. 
Technical owner for Interconnect reliability test design and methodology. 
Representative of process characterization team and project team

[Requirements]
Min 5 years¡¯ experience in semiconductor manufacturing environment
Experience in wire bonding and assembly processes is an advantage.
Extensive device physics knowledge.

[AUTHORITY LEVEL]
In consultation with the Group leader/Quality Manager, on-hold lots with process reliability issue.

[POSITION REQUIREMENTS]
1. Qualification: PHD / Master/ Bachelor degree in Electronic Engineering (Material, Semiconductor Physics, Microelectronics).
2. Experience: > 5 years working experience in foundry environment, preferably in reliability test of semiconductor devices.
3. Skills/Competencies:
Behavioral Competencies
a) Strong project administration skills – planning/organizing/co-ordination & documentation
b) Good communication skills – fluent in English, written and spoken
c) Good interpersonal skills – to deal with people of all levels
d) Good team work in multi-cultural environment

Technical/ Functional Competencies
a) In depth knowledge of semiconductor device reliability method and test.
b) Understanding of process integration work and process flow.
c) Understanding of semiconductor device operation and device characterization.
d) Strong knowledge in device physics related to IC failure mechanisms.
e) Strong interest in state of the art semiconductor devices development.
f) Understand of data analysis and statistical methods.

[Location]
Position based in Kuching, Malaysia

[Number of Persons] 1

[Salary Expectation]
Negotiable

[Foreign Languages] English

[Apply a Position]
Please send your English resume(Documents/ CVs must be written in English)A.S.A.P (MS word only)by E-mail top@topheadhunter.co.kr
* The title of E-mail should be BEOL Interconnect Reliability Engineer in Multinational microelectronic industry Co
* All submitted documents will be treated with highly confidential manner.
Thank you for your interest.

[Contact]
Tel No 82-2-555-7234
E-mail top@topheadhunter.co.kr

* ¿Ü±¹±Ù¹«½Ã ±¹³» ¿¬ºÀ¿¬ºÀº¸´Ù»ó½Â, ÁÖ°Å(Áý), Â÷·®(Â÷·®À¯Áöºñ), Àڳ౳À°ºñ(±¹Á¦Çб³) µîÀÌ Áö¿øµÇ´Â°ÍÀÌ ±âº» ÀÔ´Ï´Ù.
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