BEOL Interconnect Reliability Engineer (Process Characterization - Technology) in Multinational microelectronic industry Co
회사는 독일에 본사가 있고 AP는 말레이지아 있는 전자 및 반도체 분야 다국적 기업으로 BEOL Interconnect Reliability Engineer를 모십니다.
BEOL Interconnect Reliability Staff / Principal Engineer (Process Characterization - Technology)
● Position based in Kuching, Malaysia
● Reports to Process Characterization Senior Section Manager
● At least 8 - 10 years working experience in foundry environment, preferably in reliability test of semiconductor devices
● In depth knowledge of semiconductor device reliability method and test.
● Understanding of process integration work and process flow.
● Understanding of semiconductor device operation and device characterization.
● Strong knowledge in device physics related to IC failure mechanisms.
● Strong interest in state of the art semiconductor devices development.
● Budget: RM7,000-RM15,000/month depending on experience & level of position (staff)
Process Characterization Senior Section Manager
To optimize BEOL Interconnect reliability in the development of mixed signal semiconductor processes, achieving robust automotive standards.
To plan, coordinate and execute of all necessary Wafer Level Reliability (WLR) design, development and debugging activities.
To develop methodology for WLR testing and assessment.
Define and develop interconnect reliability characterization strategy in mixed signal semiconductor processes.
Define, develop and evaluate reliability procedures and methodology.
Involve in characterization and analysis for the reliability of mixed signal semiconductor devices.
New and existing technologies reliability test structure and test algorithms development and enhancement, also include modification and maintenance.
Make and present reliability result in appropriate documentation and also to customers.
Make assessment of new WLR reliability testing.
To plan, manage and technically supervise reliability for new technology development projects.
Align project objective with company overall business goals
Project partner of new technology Interconnect reliability development and qualification.
Technical owner for Interconnect reliability test design and methodology.
Representative of process characterization team and project team
1. Qualification: PHD / Master/ Bachelor degree in Electronic Engineering (Material, Semiconductor Physics, Microelectronics).
2. Experience: > 5 years working experience in foundry environment, preferably in reliability test of semiconductor devices.
a) Strong project administration skills – planning/organizing/co-ordination & documentation
b) Good communication skills – fluent in English, written and spoken
c) Good interpersonal skills – to deal with people of all levels
d) Good team work in multi-cultural environment
Technical/ Functional Competencies
a) In depth knowledge of semiconductor device reliability method and test.
b) Understanding of process integration work and process flow.
c) Understanding of semiconductor device operation and device characterization.
d) Strong knowledge in device physics related to IC failure mechanisms.
e) Strong interest in state of the art semiconductor devices development.
f) Understand of data analysis and statistical methods.
Position based in Kuching, Malaysia
[Number of Persons] 1
Budget: RM7,000-RM15,000/month depending on experience & level of position (staff)
[Foreign Languages] English
[Apply a Position]
Please send your English resume(Documents/ CVs must be written in English)A.S.A.P (MS word only)by E-mail email@example.com
* The title of E-mail should be BEOL Interconnect Reliability Engineer in Multinational microelectronic industry Co
* All submitted documents will be treated with highly confidential manner.
Thank you for your interest.
서만식 Man Sik Seo (외국계다국전기업 헤드헌팅 20년 전문 경력을 가진 최고의 헤드헌터)
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